JPS6065553A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS6065553A
JPS6065553A JP7165384A JP7165384A JPS6065553A JP S6065553 A JPS6065553 A JP S6065553A JP 7165384 A JP7165384 A JP 7165384A JP 7165384 A JP7165384 A JP 7165384A JP S6065553 A JPS6065553 A JP S6065553A
Authority
JP
Japan
Prior art keywords
groove
heat sink
power transistor
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7165384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410742B2 (en]
Inventor
Kikuo Isoyama
磯山　貴久雄
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP7165384A priority Critical patent/JPS6065553A/ja
Publication of JPS6065553A publication Critical patent/JPS6065553A/ja
Publication of JPH0410742B2 publication Critical patent/JPH0410742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP7165384A 1984-04-10 1984-04-10 混成集積回路 Granted JPS6065553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7165384A JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7165384A JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6065553A true JPS6065553A (ja) 1985-04-15
JPH0410742B2 JPH0410742B2 (en]) 1992-02-26

Family

ID=13466778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7165384A Granted JPS6065553A (ja) 1984-04-10 1984-04-10 混成集積回路

Country Status (1)

Country Link
JP (1) JPS6065553A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230256A (ja) * 1988-03-10 1989-09-13 Fuji Electric Co Ltd 半導体装置
US7235876B2 (en) * 2005-09-12 2007-06-26 Denso Corporation Semiconductor device having metallic plate with groove

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643166U (en]) * 1979-09-10 1981-04-20
JPS5840848A (ja) * 1981-09-04 1983-03-09 Hitachi Ltd 絶縁型半導体装置
JPS6233330U (en]) * 1985-08-15 1987-02-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643166U (en]) * 1979-09-10 1981-04-20
JPS5840848A (ja) * 1981-09-04 1983-03-09 Hitachi Ltd 絶縁型半導体装置
JPS6233330U (en]) * 1985-08-15 1987-02-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230256A (ja) * 1988-03-10 1989-09-13 Fuji Electric Co Ltd 半導体装置
US7235876B2 (en) * 2005-09-12 2007-06-26 Denso Corporation Semiconductor device having metallic plate with groove

Also Published As

Publication number Publication date
JPH0410742B2 (en]) 1992-02-26

Similar Documents

Publication Publication Date Title
US4524238A (en) Semiconductor packages
CA2160829A1 (en) Electronic Component and Method for Fabricating the Same
JPS58128753A (ja) 電気構成部分のためのケ−シング
JPH06177295A (ja) 混成集積回路装置
JPS6065553A (ja) 混成集積回路
JPS6233330Y2 (en])
JP2698259B2 (ja) ヒートシンクの製造方法
JPH04180689A (ja) パワーデバイス実装板
JPH025539Y2 (en])
JPH0338746B2 (en])
JPS6311735Y2 (en])
JPH0338745B2 (en])
JPH03263857A (ja) 大電流貫通体付外囲器およびその製造方法
JPH05129515A (ja) 半導体装置
JP3171330B2 (ja) 半導体装置
JPS645895Y2 (en])
JP2575836Y2 (ja) 半導体装置
JPS60216572A (ja) ヒ−トシンクの製造方法
JPH0561780B2 (en])
JPH01137690A (ja) 電気回路基板
JPH0353779B2 (en])
JPH08316656A (ja) 電子部品用パッケージ
JPS55128837A (en) Base for mounting semiconductor chip
KR100244475B1 (ko) 정전처크 및 그 제조방법
JPH0519959Y2 (en])